Mô tả ngắn:Nano-focus X-ray Non-destructive analysis system for Wafer Level PackagingHigh-resolution image with Dual Type CTsTSV, Micro Bump, Pattern
Liên hệ: 0976.275.983 hoặc 09126.96.36.199 hoặc email: firstname.lastname@example.org - Mr. Hoàng Anh Quý!
Nano-focus X-ray Inspection System
Nano-focus Tube of 200 nano resolution is installed which is specialized for Semiconductor Packaging, Wafer Level Packaging(WLP) requiring detection of Sub-micron defects.
Able to trace and inspect defected area precisely by precise movement of axis with Anti-vibration table.
Tomography is available if 3D CT module is added and Wafer Bump Automatic Inspection is available from loading to inspection with wafer handler systems.
||120 kV / 200 µA
||6 inch FPXD
|CT Scan Method
||Oblique CT / Cone beam CT
||2,380 x 1,450 x 2,120 mm Control Box : 600 x 1,250 x 1,030 mm
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